The use of SolarBond® pressure-sensitive tapes, will simplify the process of bonding junction boxes to the back of the modules. By utilizing a custom die-cut shape and semi automated "pick and place" technology, the box can be positioned and placed precisely.
High tack pressure sensitive adhesive insures immediate bond and quick adhesion build. No waiting for cure, no concerns with VOC's and no cleaning helps drive down manufacturing costs.
Visit our Foams Website for more information.